Build the system
around the board.
A surface-mount technology system works when each process hands off cleanly to the next.
From paste
to proof.
Redrock can help structure an SMT production line around product type, PCB size, component mix, monthly output, changeover frequency and quality targets.
Solder paste printer
Establish a stable print process before placement. Confirm stencil, board support, paste profile and inspection requirements.
Pick-and-place machine
Match placement heads, feeder capacity, vision, component range and changeover needs to the real product mix.
Reflow soldering
Use thermal profiling to connect paste, board mass, component density and line speed into a repeatable soldering process.
PCB loader / unloader
Reduce manual handoffs and keep board transfer consistent at the line entrance and exit.
AOI inspection equipment
Bring inspection and traceability into the line plan so defects become actionable process data.
Installation and training
Plan commissioning, operator training, programming, maintenance, spares and response expectations before handover.