PRODUCTS / ST-RF850-CPD
Reflow soldering for complete SMT production lines
Eight-Zone Large Hot-Air Reflow Oven
ST-RF850-CPD is an eight-zone hot-air reflow oven for controlled thermal processing after solder paste printing and component placement.
Repeatable thermal profiles
A reflow oven should be selected around the solder paste profile, PCB mass, component mix, line speed and cooling requirements. Engineers should validate the profile with actual boards rather than comparing zone counts alone.
Complete-line context
ST-RF850-CPD can be evaluated alongside a solder paste printer, pick-and-place machine, PCB loader/unloader and AOI inspection equipment as part of a complete surface-mount technology system.